Micromachined microsieves with high aspect ratio features

Journal of Microelectromechanical Systems

Volumn 21, Issue 1, 2012, Pages 68-75

  Vaeth, Kathleen M ^a  

^a EASTMAN KODAK COMPANY   (United States)

Author keywords

Microfiltration; microfluidics; micromachining

Indexed keywords

DRY ETCH PROCESS; HIGH ASPECT RATIO; MICROMACHINED; MICROSIEVES; MONODISPERSE POLYMERS; PORE DIAMETERS; SILICON MEMBRANES; SILICON ON INSULATOR WAFERS; THIN DIELECTRIC LAYER;

ARCHITECTURE; MICROFILTRATION; MICROFLUIDICS; MICROMACHINING;

ASPECT RATIO;

EID: 84858451389     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2011.2171324     Document Type: Article

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