New discoveries in ultrasonic consolidation nano-structures using emerging analysis techniques

Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications

Volumn 225, Issue 4, 2011, Pages 277-287

  Johnson, K ^a   Edmonds, H C ^b   Higginson, R L ^b   Harris, R A ^b  

^a Solidica Inc   (United States)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Dual beam focused ion beam etchingc; Grain refinement; Oxide layer; Ultrasonic consolidation

Indexed keywords

ANALYSIS TECHNIQUES; BOND FORMATION; BONDING INTERFACES; DIRECT CONTACT; DISLOCATION SLIP; DISLOCATION STRUCTURES; DUAL BEAM; DUAL BEAM FOCUSED ION BEAM-ETCHINGC; INTERFACE DYNAMIC; NANO GRAINS; NANO SCALE; NON-PLANAR INTERFACES; OXIDE LAYER; SONOTRODES; SUBGRAINS; SURROUNDING MATERIALS; TRANSMISSION ELECTRON MICROSCOPY (TEM); ULTRASONIC CONSOLIDATION;

FOCUSED ION BEAMS; GRAIN REFINEMENT; GRAIN SIZE AND SHAPE; MANGANESE; TRANSMISSION ELECTRON MICROSCOPY; ULTRASONICS; WELDING; WELDS;

INTERFACES (MATERIALS);

EID: 84858206355     PISSN: 14644207     EISSN: 20413076     Source Type: Journal    
DOI: 10.1177/0954420711413656     Document Type: Conference Paper

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