Mushroom-type high-impedance surface with loaded vias: Homogenization model and ultra-thin design

IEEE Antennas and Wireless Propagation Letters

Volumn 10, Issue , 2011, Pages 1503-1506

  Kaipa, Chandra S R ^a   Yakovlev, Alexander B ^a   Maslovski, Stanislav I ^b   Silveirinha, Mrio G ^b  

^a UNIVERSITY OF MISSISSIPPI   (United States)

^b UNIVERSITY OF COIMBRA   (Portugal)

Author keywords

Analytical modeling; electromagnetic band gap (EBG) structures; high impedance surface (HIS); homogenization; leaky waves; spatial dispersion (SD); surface waves; wire medium (WM)

Indexed keywords

ANALYTICAL MODELING; ELECTROMAGNETIC BANDGAP STRUCTURES; HIGH-IMPEDANCE SURFACES; HOMOGENIZATION; LEAKY WAVES; SPATIAL DISPERSION; WIRE MEDIUM (WM);

ANTENNAS; ELECTRONICS ENGINEERING;

SURFACE WAVES;

EID: 84856961926     PISSN: 15361225     EISSN: None     Source Type: Journal    
DOI: 10.1109/LAWP.2011.2180694     Document Type: Article

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