Increase of tape wound core losses due to interlamination short circuits and orthogonal flux components

IECON Proceedings (Industrial Electronics Conference)

Volumn , Issue , 2011, Pages 1372-1377

  Cougo, B ^a   Tuysuz A ^a   Muhlethaler J ^a   Kolar, J W ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CORE LOSS; FRINGING FIELDS; LAMINATED CORE; LAYER PLANES; MACHINING METHODS; STRAY FIELD; TAPE WOUND CORES;

COREMAKING; INDUSTRIAL ELECTRONICS; LAMINATING;

MAGNETIC CORES;

EID: 84856534790     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IECON.2011.6119508     Document Type: Conference Paper

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