Integration of Ni-Cu-Zn ferrite in low temperature co-fired ceramics (LTCC) modules

International Journal of Applied Ceramic Technology

Volumn 9, Issue 1, 2012, Pages 18-28

  Rabe, Torsten ^a   Naghib Zadeh, Hamid ^a   Glitzky, Carsten ^a,c   Töpfer, Jörg ^b  

^a BAM FEDERAL INSTITUTE FOR MATERIALS RESEARCH AND TESTING   (Germany)

^b UNIVERSITY OF APPLIED SCIENCES JENA   (Germany)

^c Royal Porcelain Manufactory (KPM)   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT BOARDS; CO-FIRING; DIELECTRIC TAPES; FERRITE GRAINS; FERRITE LAYERS; FERRITE TAPE; FREE OF CRACKS; FUNCTIONAL COMPONENTS; GLASS PHASE; HIGH THERMAL; HOMOGENEOUS MICROSTRUCTURE; LARGE-GRAIN; LOW-TEMPERATURE CO-FIRED CERAMICS; MICROPROBE ANALYSIS; OPEN POROSITY; SHRINKAGE BEHAVIOR; SINTERING TEMPERATURES; STRONG CORRELATION; TEMPERATURE RANGE; THERMAL CONTRACTION;

DIELECTRIC MATERIALS; FERRITES; LAMINATES; SINTERING; TAPES; THERMAL EXPANSION; ZINC;

FERRITE;

EID: 84855950061     PISSN: 1546542X     EISSN: 17447402     Source Type: Journal    
DOI: 10.1111/j.1744-7402.2011.00712.x     Document Type: Article

References (8)

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