LTCC-modules with integrated ferrite layers-strategies for material development and co-sintering

Journal of Microelectronics and Electronic Packaging

Volumn 6, Issue 1, 2009, Pages 49-53

  Glitzky, Carsten ^a   Rabe, Torsten ^a   Eberstein, Markus ^a   Schiller, Wolfgang A ^a   Töpfer, Jörg ^b   Barth, Stefan ^c   Kipka, Annette ^d  

^a BAM FEDERAL INSTITUTE FOR MATERIALS RESEARCH AND TESTING   (Germany)

^b UNIVERSITY OF APPLIED SCIENCES JENA   (Germany)

^c Hermsdorfer Inst Tech Keramik e V   (Germany)

^d WC Heraeus GmbH   (Germany)

Author keywords

Coefficient of thermal expansion (CTE); Cofiring; Ferrite; LTCC; Shrinkage

Indexed keywords

CRACKS; DEFECTS; FERRITE; FERRITE DEVICES; INTERFACES (MATERIALS); MULTILAYERS; SHRINKAGE; SINTERING; TAPES; THERMAL EXPANSION;

CO-FIRING; COEFFICIENTS OF THERMAL EXPANSIONS; COMPOSITIONAL CHANGES; DEFECT FREE MULTILAYERS; DIELECTRIC AND FERRITE LAYERS; LTCC; MATERIAL DEVELOPMENT; MULTILAYER ASSEMBLIES;

DIELECTRIC MATERIALS;

EID: 84891607875     PISSN: 15514897     EISSN: None     Source Type: Journal    
DOI: 10.4071/1551-4897-6.1.49     Document Type: Article

References (7)

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