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Volumn 53, Issue , 2012, Pages 1-7

Use of carbon nanostructures in transient spike power applications

Author keywords

Carbon nanofibers; Mechanical characterization; Transient power spikes

Indexed keywords

BUCKYPAPER; CARBON NANOSTRUCTURES; COLD PLATES; CRYTALLINITY; DRY CONTACT; HEAT PULSE; HEAT TRANSPORT; HEAT TREATMENT TEMPERATURE; HIGH TEMPERATURE; HIGH THERMAL CONDUCTIVITY; MECHANICAL CHARACTERIZATIONS; PARAMETRIC STUDY; POWER APPLICATIONS; POWER SPIKES; TEMPERATURE RESISTANT; THERMAL INTERFACE MATERIALS; TRANSIENT LOAD;

EID: 84855801787     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2011.11.011     Document Type: Article
Times cited : (3)

References (30)
  • 2
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    • Intel Inc.
    • Intel Inc.
  • 3
    • 84855776839 scopus 로고    scopus 로고
    • The International Technology Roadmap for Semiconductor 2000
    • The International Technology Roadmap for Semiconductor 2000.
  • 4
    • 84855774834 scopus 로고    scopus 로고
    • The International Technology Roadmap for Semiconductor 2001
    • The International Technology Roadmap for Semiconductor 2001.
  • 5
    • 84855776838 scopus 로고    scopus 로고
    • The International Technology Roadmap for Semiconductor 2002
    • The International Technology Roadmap for Semiconductor 2002.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.