Diffusion bonding of stainless steel to copper with tin bronze and gold interlayers

Journal of Materials Engineering and Performance

Volumn 21, Issue 1, 2012, Pages 33-37

  Xiong, Jiang Tao ^a   Xie, Qing ^b   Li, Jing Long ^b   Zhang, Fu Sheng ^b   Huang, Wei Dong ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

^b NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

contact melting; diffusion bonding; grain boundary wetting

Indexed keywords

AU FOIL; AXIAL PRESSURES; COMPOSITE INTERLAYERS; CONTACT MELTING; GRAIN BOUNDARY WETTING; JOINING TEMPERATURE; LOW TEMPERATURES; VACUUM DIFFUSION BONDING;

BRONZE; COMPOSITE FILMS; COMPRESSION RATIO (MACHINERY); COPPER; DIFFUSION; DIFFUSION BONDING; GRAIN BOUNDARIES; JOINING; MELTING; METAL MELTING; TENSILE STRENGTH; TIN; WETTING;

STAINLESS STEEL;

EID: 84855545012     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11665-011-9870-y     Document Type: Article

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