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Journal of Electronic Materials

Volumn 41, Issue 2, 2012, Pages 313-321

Size control and characterization of Sn-Ag-Cu lead-free nanosolders by a chemical reduction process

(5) Yung, K C a Law, C M T a Lee, C P a Cheung, B a Yue, T M a

a HONG KONG POLYTECHNIC UNIVERSITY (Hong Kong)

Author keywords

chemical reduction; Lead free; melting temperature; nanosolders; Sn 3.0Ag 0.5Cu

Indexed keywords

CHEMICAL REDUCTION; LEAD-FREE; MELTING TEMPERATURES; NANOSOLDERS; SN-3.0AG-0.5CU;

CITRIC ACID; DIFFERENTIAL SCANNING CALORIMETRY; LEAD; MELTING POINT; METAL MELTING; PACKAGING MATERIALS; PARTICLE SIZE; PHASE TRANSITIONS; SILVER; SILVER ALLOYS; SODIUM; SOLDERING ALLOYS; SURFACE ACTIVE AGENTS; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

TIN;

EID: 84855464455 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-011-1765-z Document Type: Article

Times cited : (26)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.