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Applied Physics A: Materials Science and Processing

Volumn 105, Issue 3, 2011, Pages 685-690

Inkjet-printed gold nanoparticulate patterns for surface finish in electronic package

(5) Jang, Seonhee a Cho, Hyejin a Kang, Seongkoo a Oh, Sungil a Kim, Donghoon a

a Samsung Electro Mechanics (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AU FILM; AU NANOPARTICLE; BULK VALUE; CAPPING LAYER; CAPPING MOLECULES; DODECYL AMINES; ELECTRICAL PROPERTY; ELECTRONIC PACKAGE; GAS FLOWS; INK-JET PRINTING METHOD; MIXED GAS; NANO PARTICULATES; ORGANIC RESIDUES; ORGANICS; POOR ADHESION; SHEAR FORCE; SHEAR TESTS; SOLDER BALL SHEAR; SURFACE FINISHES;

ADHESION; ELECTRIC PROPERTIES; FILM GROWTH; FINISHING; FLOW OF GASES; FORMIC ACID; GRAIN GROWTH; MICROSTRUCTURE; PRINTING; SINTERING; SOLDERING;

GOLD;

EID: 83555172236 PISSN: 09478396 EISSN: 14320630 Source Type: Journal
DOI: 10.1007/s00339-011-6610-y Document Type: Article

Times cited : (4)

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