Microstructure changes in nanoparticulate gold films under different thermal atmospheres and the effects on bondability

Acta Materialia

Volumn 57, Issue 18, 2009, Pages 5613-5620

  Jang, Seonhee ^a   Joung, Jaewoo ^a   Oh, Yongsoo ^a  

^a Samsung Electro Mechanics   (South Korea)

Author keywords

Coalescence; Gold; Grain growth; Nanoparticle; Sintering

Indexed keywords

AU FILM; AU(1 1 1 ); BONDABILITY; BULK VALUE; C-O STRETCH; DECOMPOSITION TEMPERATURE; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; FOCUSED ION BEAM ANALYSIS; FOUR POINT PROBE; GOLD NANOPARTICLES; MICROSTRUCTURE CHANGES; NANOPARTICULATE GOLD; NECK GROWTH; ORGANIC CAPPING; ORGANIC RESIDUES; THERMAL ATMOSPHERE; WIRE BONDING; X RAY DIFFRACTOMETRY;

ATMOSPHERIC TEMPERATURE; ATOMIC FORCE MICROSCOPY; COALESCENCE; ELECTRIC RESISTANCE; FIELD EMISSION; FIELD EMISSION MICROSCOPES; FILM GROWTH; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GOLD ALLOYS; GRAIN GROWTH; GRAIN SIZE AND SHAPE; GRAVIMETRIC ANALYSIS; INK; MICROSTRUCTURE; NANOPARTICLES; ORGANIC ACIDS; SCANNING ELECTRON MICROSCOPY; SINTERING; SPACE PROBES; SPECTROSCOPIC ANALYSIS; SPECTROSCOPY; TRANSMISSION ELECTRON MICROSCOPY; WIRE; X RAY DIFFRACTION ANALYSIS;

GOLD;

EID: 70349312943     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.07.059     Document Type: Article

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