Allocating solder-paste printing inspection in high-volume electronics manufacturing

IIE Transactions (Institute of Industrial Engineers)

Volumn 36, Issue 12, 2004, Pages 1171-1181

  Valenzuela, Jorge F ^a   Smith, Jeffrey S ^a   Evans, John L ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEURISTIC METHODS; INSPECTION; MATHEMATICAL MODELS; OPTIMIZATION; PRINTED CIRCUIT MANUFACTURE; SOLDERING ALLOYS;

HIGH VOLUME ELECTRONICS MANUFACTURING; OPTIMIZATION MODEL; SOLDER PASTE PRINTING;

QUALITY CONTROL;

EID: 8344219768     PISSN: 0740817X     EISSN: None     Source Type: Journal    
DOI: 10.1080/07408170490507710     Document Type: Article

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