Thermal conductivity and fire resistance of epoxy molding compounds filled with Si3N4 and Al(OH)3

Materials and Design

Volumn 34, Issue , 2012, Pages 820-824

  Shi, Zhixiang ^a   Fu, Renli ^a   Agathopoulos, Simeon ^b   Gu, Xiguang ^a   Zhao, Weiwei ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b UNIVERSITY OF IOANNINA   (Greece)

Author keywords

Al(OH)3; Composites; Fire retardation; Polymer; Si3N4; Thermal conductivity

Indexed keywords

BURNING BEHAVIOR; ELECTRONIC PACKAGING; EPOXY MATRICES; EPOXY MOLDING COMPOUNDS; FIRE RETARDATION; HIGH THERMAL CONDUCTIVITY; LIMITING OXYGEN INDEX; OPTIMUM COMBINATION; THERMAL CONDUCTIVITY MEASUREMENTS; VERTICAL BURNING TESTS; VOLUME RATIO;

ALUMINUM; COMPOSITE MATERIALS; ELECTRONICS PACKAGING; FILLERS; FLAME RESISTANCE; FLAME RETARDANTS; MOLDING; POLYMERS; SHEET MOLDING COMPOUNDS; SILICON;

THERMAL CONDUCTIVITY;

EID: 82455199262     PISSN: 02641275     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2011.07.012     Document Type: Article

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