Tailoring ion energy distributions using pulsed plasmas

IEEE Transactions on Plasma Science

Volumn 39, Issue 11 PART 1, 2011, Pages 2520-2521

  Agarwal, Ankur ^a   Rauf, Shahid ^a   Collins, Ken ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

Inductively coupled plasma; ion energy and angular distribution; plasma etching; plasma modeling; pulse frequency; pulsed plasma

Indexed keywords

CAPACITIVELY COUPLED PLASMA REACTORS; CHANGING OPERATING CONDITIONS; INDUCTIVELY COUPLED PLASMA REACTOR; ION ENERGY AND ANGULAR DISTRIBUTION; ION ENERGY DISTRIBUTION FUNCTIONS; ION ENERGY DISTRIBUTIONS; MULTI FREQUENCY; PLASMA MODELING; PULSE FREQUENCIES; PULSED PLASMA;

ANGULAR DISTRIBUTION; ELECTRIC POWER DISTRIBUTION; INDUCTIVELY COUPLED PLASMA; IONS; PLASMA ETCHING; PLASMA SOURCES;

COUPLED CIRCUITS;

EID: 81255151986     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPS.2011.2154343     Document Type: Article

References (1)

1. A. Agarwal, P. J. Stout, S. Banna, S. Rauf, K. Tokashiki, J.-Y. Lee, and K. Collins, "Effect of simultaneous source and bias pulsing in inductively coupled plasma etching", J. Appl. Phys., vol. 106, no. 10, pp. 103 305-1-103 305-12, Nov. 2009.