Electrical modulus analysis on the Ni/CCTO/PVDF system near the percolation threshold

Journal of Physics D: Applied Physics

Volumn 44, Issue 47, 2011, Pages

  Yang, Wenhu ^a,b   Yu, Shuhui ^a   Sun, Rong ^a   Ke, Shanming ^c   Huang, Haitao ^c   Du, Ruxu ^a,d  

^a SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^c HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^d CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

AC CONDUCTIVITY; CERAMIC FILLERS; CONDUCTING STATE; CONDUCTIVE CHANNELS; ELECTRICAL MODULUS; FILLER CONTENTS; INTERFACIAL POLARIZATION; MATRIX; NI CONTENT; NI LOADING; PERCOLATION THRESHOLDS; PHYSICAL MECHANISM;

PERCOLATION (COMPUTER STORAGE); PERCOLATION (FLUIDS); PERCOLATION (SOLID STATE); PERMITTIVITY; POLARIZATION; SOLVENTS;

FILLERS;

EID: 81155124188     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/44/47/475305     Document Type: Article

References (35)

1. Nan C W, Shen Y and Ma J 2010 Annu. Rev. Mater. Res. 40 131-51
2. Panda M, Srinivas V and Thakur A K 2008 Appl. Phys. Lett. 92 132905
3. Dang Z M, Shen Y and Nan C W 2002 Appl. Phys. Lett. 81 4184
4. Yang W H, Yu S H, Sun R and Du R X 2011 Acta Mater. 59 5593-602
5. Feng Q P, Yang J P, Fu S Y and Mai Y W 2010 Carbon 48 2057-62
6. Zheng W, Lu X, Wang W, Wang Z, Song M, Wang Y and Wang C 2010 Phys. Status Solidi a 207 1870-3
7. Li Y J, Xu M, Feng J Q and Dang Z M 2006 Appl. Phys. Lett. 89 072902
8. Bloor D, Donnelly K, Hands P J, Laughlin P and Lussey D 2005 J. Phys. D: Appl. Phys. 38 2851-60
9. Prakash B S and Varma K B R 2007 Compos. Sci. Technol. 67 2363-8
10. Dietze M, Krause J, Solterbeck C H and Es-Sounia M 2007 J. Appl. Phys. 101 054113
11. Dang Z M, Lin Y H and Nan C W 2002 Appl. Phys. Lett. 81 4814
12. Arbatti M, Shan X B and Cheng Z Y 2007 Adv. Mater. 19 1369-72
13. Nan C W 1993 Prog. Mater. Sci. 37 1-116
14. Blaszkiewicz M, McLachlan D S and Newnham R E 1991 J. Mater. Sci. 26 5899-903
15. Untereker Lyu D S, Schley J, Martinez G and Lohstreter L 2009 ACS Appl. Mater. Interfaces 1 97-101
16. Carmona F and Ravier J 2002 Carbon 40 151-6
17. Belattar J, Graça M P F, Costa L C, Achour M E and Brosseau C 2010 J. Appl. Phys. 107 124111
18. Andrews R and Opin C 2004 Solid State Mater. Sci. 8 31-7
19. Hernandez Y R, Gryson A, Blighe F M, Cadek M, Nicolosi V, Blau W J, Gunko Y K and Coleman J N 2008 Scr. Mater. 58 69-72
20. Dang Z M, Wang L, Yin Y, Zhang Q and Lei Q Q 2007 Adv. Mater. 19 852-7
21. Zhang J, Mine M, Zhu D and Matsuo M 2009 Carbon 47 1311-20
22. Mudarra M, Díaz-Calleja R, Belana J, Cãadas J C, Diego J A, Sellarès J and Sanchís M J 2001 Polymer 42 1647-51
23. Sidebottom D L 2009 Rev. Mod. Phys. 81 999-1014
24. George S and Sebastian M T 2009 Compos. Sci. Technol. 69 1298-302
25. Wang G S 2010 ACS Appl. Mater. Interfaces 2 1290-3
26. Rao Y, Qu J, Marinis T and Wong C P 2000 IEEE Trans. Compon. Packag. Technol. 23 680-3
27. Yang W H, Yu S H, Sun R and Du R X 2010 ICEPT-HDP 11th Int. Conf. (Xi'an, China 16-19 August) pp 460-3
28. Kerr C J, Huang Y Y, Marshall J E and Terentjev E M 2011 J. Appl. Phys. 109 094109
29. Molak A, Paluch M, Pawlus S, Klimontko J, Ujma Z and Gruszka I 2005 J. Phys. D: Appl. Phys. 38 1450-60
30. Jonscher A K 1999 J. Phys. D: Appl. Phys. 32 R57-70
31. Xu H P, Dang Z M, Bing N C, Wu Y H and Yang D D 2010 J. Appl. Phys. 107 034105
32. Bober P, Stejskal J, Trchov M, Proke J and Sapurina I 2010 Macromolecules 43 10406-13
33. Lee H and Bhushan B 2011 J. Colloid Interface Sci. 360 777-84
34. Vionnet-Menot S, Grimaldi C, Maeder T, Strässler S and Ryser P 2005 Phys. Rev. B 71 064201
35. Fu D S, Taniguchi H, Taniyama H, Itoh M and Koshihara S 2008 Chem. Mater. 20 1694-8