Lead-free ternary perovskite compounds with large electromechanical strains

Applied Physics Letters

Volumn 99, Issue 15, 2011, Pages

  Jarupoom, Parkpoom ^a,b,c   Patterson, Eric ^a   Gibbons, Brady ^a   Rujijanagul, Gobwute ^b   Yimnirun, Rattikorn ^a,d   Cann, David ^a  

^a 1148 Kelley Engineering Center Corvallis   (United States)

^b CHIANG MAI UNIVERSITY   (Thailand)

^c RAJAMANGALA UNIVERSITY OF TECHNOLOGY LANNA   (Thailand)

^d SURANAREE UNIVERSITY OF TECHNOLOGY   (Thailand)

Author keywords

[No Author keywords available]

Indexed keywords

APPLIED FIELD; ELECTROMECHANICAL STRAIN; ENDMEMBERS; LEAD-FREE; PB-FREE; PEROVSKITE COMPOUNDS; PEROVSKITE SOLID SOLUTIONS; PIEZOELECTRIC COEFFICIENT; PURE STATE; SOLID SOLUBILITIES; TIO;

LEAD; LEAD COMPOUNDS; PEROVSKITE; PIEZOELECTRICITY; SODIUM; TERNARY SYSTEMS;

BISMUTH COMPOUNDS;

EID: 80055020230     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3647627     Document Type: Article

References (22)

1. T. R. Shrout and S. J. Zhang, J. Electroceram. 19, 113 (2007). 10.1007/s10832-007-9047-0
2. V. A. Isupov, Ferroelectr. Rev. 315, 123 (2005). 10.1080/001501990910276
3. S. Zhao, G. Li, A. Ding, T. Wang, and Q. Yin, J. Phys. D: Appl. Phys. 39 (10), 2277 (2006). 10.1088/0022-3727/39/10/042
4. T. Takenaka, H. Nagata, and Y. Hiruma, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 56 (8), 1595 (2009). 10.1109/TUFFC.2009.1224
5. K. Yoshii, Y. Hiruma, H. Nagata, and T. Takenaka, Jpn. J. Appl. Phys., Part 1 45 (5B), 4493 (2006). 10.1143/JJAP.45.4493
6. Y. S. Sung, H. M. Lee, W. Du, H. G. Yeo, S. C. Lee, J. H. Cho, T. K. Song, and M. H. Kim, Appl. Phys. Lett. 94, 062901 (2009). 10.1063/1.3081018
7. A. Hussain, C. W. Ahn, J. S. Lee, A. Ullah, and I. W. Kim, Sens. Actuators, A 158, 84 (2010). 10.1016/j.sna.2009.12.027
8. W. Jo, T. Granzow, E. Aulbach, J. Rodel, and D. Damjanovic, J. Appl. Phys. 105, 094102 (2009). 10.1063/1.3121203
9. Y. Hiruma, H. Nagata, and T. Takenaka, J. Appl. Phys. 104 (12), 124106 (2008). 10.1063/1.3043588
10. M. R. Suchomel and P. K. Davies, Appl. Phys. Lett. 86 (26), 262905 (2005). 10.1063/1.1978980
11. R. E. Eitel, C. A. Randall, T. R. Shrout, P. W. Rehrig, W. Hackenberger, and S. E. Park, Jpn. J. Appl. Phys. Part 1 40 (10), 5999 (2001). 10.1143/JJAP.40.5999
12. C. C. Huang, N. Vittayakorn, and D. P. Cann, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 56 (7), 1304 (2009). 10.1109/TUFFC.2009.1186
13. M. Sutapun, C. C. Huang, D. P. Cann, and N. Vittayakorn, J. Alloy. Compd. 479, 462 (2009). 10.1016/j.jallcom.2008.12.096
14. C. C. Huang, D. P. Cann, X. Tan, and N. Vittayakorn, J. Appl. Phys. 102 (4), 044103 (2007). 10.1063/1.2769787
15. C. J. Stringer, T. R. Shrout, C. A. Randall, and I. M. Reaney, J. Appl. Phys. 99 (2), 024106 (2006). 10.1063/1.2163986
16. ASTM, C 373-88 (Reapproved 1999) (ASTM International, West Conshohocken, PA, 2006), Vol. 15.02, p. 122.
17. C. C. Huang, Ph.D. thesis, Oregon State University, 2009.
18. S. Sharma and D. Hall, J. Mater. Sci.: Mater. Electron. 21 (4), 405 (2010). 10.1007/s10854-009-9933-0
19. C. C. Huang and D. P. Cann, J. Appl. Phys. 104 (2), 024117 (2008). 10.1063/1.2960469
20. K. T. P. Seifert, W. Jo, and J. Rodel, J. Am. Ceram. Soc. 93 (5), 1392 (2010). 10.1111/j.1551-2916.2009.03573.x
21. M. Hinterstein, M. Knapp, M. HoN lzel, W. Jo, A. Cervellino, and H. Ehrenberg, J. Appl. Cryst. 43, 1314 (2010). 10.1107/S0021889810038264
22. 3, J. Am. Ceram. Soc. (to be published), 10.1111/j.1551-2916.2011.04631.x.