Orientation dependence of thermal conductivity in copper-graphene composites

Journal of Applied Physics

Volumn 110, Issue 7, 2011, Pages

  Jagannadham, K ^a  

^a North Carolina State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER SUBSTRATES; ELECTRICALLY INSULATING FILMS; ELECTROCHEMICAL DEPOSITION; GRADIENT OF TEMPERATURE; GRAPHENE MULTILAYERS; GRAPHENE PLANE; INTERFACE THERMAL RESISTANCE; LIMITING FACTORS; ORIENTATION DEPENDENCE; PLANE DIRECTIONS; STEADY STATE;

COMPOSITE FILMS; COPPER; GOLD COATINGS; GOLD DEPOSITS; GRAPHENE; MULTILAYER FILMS; MULTILAYERS; PLASTIC FILMS; POLYMER FILMS; REDUCTION; YTTRIA STABILIZED ZIRCONIA; ZIRCONIA;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 80055001458     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3641640     Document Type: Article

References (26)

1. A. A. Balandin, S. Ghosh, W. Bao, I. Calizo, D. Teweidebrhan, F. Miao, and C. N. Lau, Nano Lett. 8, 92 (2008). 10.1021/nl0731872
2. P. Kim, L. Shi, A. Majumdar, and P. L. McEuen, Phys. Rev. Lett. 87, 215502 (2001). 10.1103/PhysRevLett.87.215502
3. K. Jagannadham, J. Electron. Mater. 40, 25 (2011). 10.1007/s11664-010- 1391-1
4. 111, 7565 (2007). 10.1021/jp071761s (Pubitemid 46918242)
5. K. Jagannadham, Thermal conductivity of copper-graphene composite films synthesized by electrochemical deposition with exfoliated graphene platelets., Met. Trans. (submitted).
6. S. Stankovich, D. A. Dikin, G. H. B. Dornmett, K. M. Kohlhass, E. J. Zimney, E. A. Stach, R. D. Piner, S. T. Nguyen, and R. S. Ruoff, Nature 442, 282 (2006). 10.1038/nature04969 (Pubitemid 44114900)
7. 111, 7565 (2007). 10.1021/jp071761s (Pubitemid 46918242)
8. A. A. Balandin, IEEE/CPMT, 27th Semiconductor Thermal Measurement and Management Symposium Proc. (SEMI-THERM 2011), San Jose, CA, 20-24 March 2011, p. 89.
9. See http://physics.info/conduction/ for information about thermal conductivity of graphite.
10. Q. Ngo, B. A. Cruden, A. M. Cassell, M. D. Walker, Q. Ye, J. E. Koehne, M. Meyyappan, J. Li, and C. Y. Yang, Mater. Res. Soc. Symp. Proc. F3.18.1, 812 (2004). 10.1557/PROC-812-F3.18
11. D. G. Cahill, Rev. Sci. Instrum. 61, 802 (1990). 10.1063/1.1141498
12. J. H. Kim, A. Feldman, and D. Novotny, J. Appl. Phys. 86, 3959 (1999). 10.1063/1.371314
13. P. M. Norris and P. E. Hopkins, J. Heat Transfer 131, 043207 (2009). 10.1115/1.3072928
14. B. C. Gundrum, D. G. Cahill, and R. S. Averback, Phys. Rev. B 72, 245426 (2005). 10.1103/PhysRevB.72.245426 (Pubitemid 43292177)
15. H.-K. Lyeo and D. G. Cahill, Phys. Rev. B 72, 144301 (2006). 10.1103/PhysRevB.73.144301 (Pubitemid 43495120)
16. E. E. Underwood, Applications of Quantitative Metallography, Mechanical Testing, 8th ed., Metals Handbook Vol. 8 (American Society for Metals, Metals Park, OH, 1973), p. 37.
17. A. J. Schmidt, K. C. Collins, A. J. Minnich, and G. Chen, J. Appl. Phys. 107, 104907 (2010). 10.1063/1.3428464
18. E. T. Swartz and R. O. Pohl, Rev. Mod. Phys. 61, 605 (1989). 10.1103/RevModPhys.61.605
19. A. Minnich and G. Chen, Appl. Phys. Lett. 91, 073105 (2007). 10.1063/1.2771040 (Pubitemid 47283595)
20. A. Majumdar and P. Reddy, Appl. Phys. Lett. 84, 4768 (2004). 10.1063/1.1758301
21. P. Nath and K. L. Chopra, Thin Solid Films 20, 53 (1974). 10.1016/0040-6090(74)90033-9
22. D. L. Nika, S. Ghosh, E. P. Pokatilov, and A. A. Balandin, Appl. Phys. Lett. 94, 203103 (2009). 10.1063/1.3136860
23. Z. Ghuo, D. Zhang, and X. G. Gong, Appl. Phys. Lett. 95, 163103 (2009). 10.1063/1.3246155
24. J. H. Seol, I. Jo, A. L. Moore, L. Lindsay, Z. H. Aitken, M. T. Pettes, X. Li, Z. Yao, R. Huang, D. Broido, N. Mingo, R. S. Ruoff, and L. Shi, Science, 328, 213 (2010). 10.1126/science.1184014
25. P. G. Klemens, Int. J. Thermophys. 22, 265 (2001). 10.1023/A: 1006776107140 (Pubitemid 33635827)
26. D. P. H. Hasselman and L. F. Johnson, J. Compos. Mater. 21, 508 (1987). 10.1177/002199838702100602