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Volumn 12, Issue 1, 2012, Pages 17-22
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Effects of controllable process factors on Al rear surface bumps in Si solar cells
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Author keywords
Al bump; Al Si contact; Al Si eutectic alloy; Aluminum back surface field; Solar cells
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Indexed keywords
AL-SI CONTACT;
AL-SI EUTECTIC ALLOYS;
ALUMINUM METAL;
ALUMINUM POWDERS;
ALUMINUM SURFACE;
BACK REFLECTANCE;
BACK SURFACE FIELDS;
CONTACT POINTS;
COOLING RATES;
HIGH DENSITY;
HIGH-EFFICIENCY SOLAR CELLS;
PROCESS FACTOR;
REAR SURFACES;
SCREEN-PRINTED;
SI SOLAR CELLS;
SILICON SURFACES;
UNIFORM TEMPERATURE;
PASSIVATION;
POWDER METALS;
RAPID THERMAL ANNEALING;
RAPID THERMAL PROCESSING;
SILICON;
SILICON ALLOYS;
SILICON WAFERS;
ALUMINUM;
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EID: 80054812324
PISSN: 15671739
EISSN: None
Source Type: Journal
DOI: 10.1016/j.cap.2011.04.021 Document Type: Article |
Times cited : (7)
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References (12)
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