Effect of stacking fault energy on deformation behavior of cryo-rolled copper and copper alloys

Materials Science and Engineering: A

Volumn 529, Issue 1, 2011, Pages 230-236

  Bahmanpour, H ^a   Kauffmann, A ^b,c   Khoshkhoo, M S ^c   Youssef, K M ^a   Mula, S ^a   Freudenberger, J ^c,d   Eckert, J ^b,c   Scattergood, R O ^a   Koch, C C ^a  

^a North Carolina State University   (United States)

^b IFW DRESDEN   (Germany)

^c DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^d TU BERGAKADEMIE FREIBERG   (Germany)

Author keywords

Activation volume; Cu based alloys; Deformation behavior; Stacking fault energy; Transmission electron microscopy; Work hardening rate

Indexed keywords

CHEMICAL ACTIVATION; COPPER ALLOYS; DEFORMATION; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; ROLLING; STRAIN HARDENING; STRESS RELAXATION; ZINC ALLOYS;

ACTIVATION VOLUME; CU BASED ALLOY; DEFORMATION BEHAVIOR; DYNAMIC RECOVERY; FAULT ENERGY; PURE COPPER; PURE CU; STACKING FAULT ENERGY; WORK HARDENING RATE; ZN ALLOYS;

DUCTILITY;

EID: 80054085613     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.09.022     Document Type: Article

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