메뉴 건너뛰기




Volumn 21, Issue 10, 2011, Pages

Fabrication and evaluation of a microspring contact array using a reel-to-reel continuous fiber process

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE FORCE; CONTACT STRUCTURE; CONTINUOUS PROCESS; ELECTRICAL CIRCUIT; ELECTRICAL CONTACTS; FIBER PROCESS; FIBER SUBSTRATES; LOW TEMPERATURES; MICROSPRING; NANO-IMPRINTING; PATTERNING TECHNIQUES; PEDOT:PSS; WOVEN TEXTILES;

EID: 80053585058     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/10/105019     Document Type: Article
Times cited : (11)

References (8)
  • 1
    • 13344275134 scopus 로고    scopus 로고
    • Weave patterned organic transistors on fiber for E-textiles
    • DOI 10.1109/TED.2004.841331
    • Lee J B and Subramanian V 2005 Weave patterned organic transistors on fiber for e-textiles IEEE Trans. Electron Devices 52 269-75 (Pubitemid 40195975)
    • (2005) IEEE Transactions on Electron Devices , vol.52 , Issue.2 , pp. 269-275
    • Lee, J.B.1    Subramanian, V.2
  • 2
    • 34247881841 scopus 로고    scopus 로고
    • Towards woven logic from organic electronic fibres
    • DOI 10.1038/nmat1884, PII NMAT1884
    • Hamedi M, Forchheimer R and Inganas O 2007 Towards woven logic from organic electronic fibres Nature Mat. Lett. 6 357-62 (Pubitemid 46693193)
    • (2007) Nature Materials , vol.6 , Issue.5 , pp. 357-362
    • Hamedi, M.1    Forchheimer, R.2    Inganas, O.3
  • 3
    • 33644607377 scopus 로고    scopus 로고
    • Interactive electronic textile development: A review of technologies
    • Meoli D and Plumlee T M 2002 Interactive electronic textile development: a review of technologies J Textile Apparel Technol Manage 2 1-12
    • (2002) J Textile Apparel Technol Manage , vol.2 , pp. 1-12
    • Meoli, D.1    Plumlee, T.M.2
  • 4
    • 34548203099 scopus 로고    scopus 로고
    • Fundamental building blocks for circuits on textiles
    • DOI 10.1109/TADVP.2007.898636, Special Section on Wafer-Level Packaging
    • Locher I and Troester G 2007 Fundamental building blocks for circuits on textiles IEEE Trans. Adv. Packag. 30 541-50 (Pubitemid 47315469)
    • (2007) IEEE Transactions on Advanced Packaging , vol.30 , Issue.3 , pp. 541-550
    • Locher, I.1    Troster, G.2
  • 5
    • 80053598240 scopus 로고    scopus 로고
    • Woven electronic textiles: An enabling technology for health-care monitoring in clothing
    • Zysset C, Kinkeldei T, Cherenack K and Troester G 2010 Woven electronic textiles: an enabling technology for health-care monitoring in clothing Proc. UbiComp '10 (Copenhagen, Denmark, 26-29 September 2010) pp 843-8
    • (2010) Proc. UbiComp '10 , pp. 843-848
    • Zysset, C.1    Kinkeldei, T.2    Cherenack, K.3    Troester, G.4
  • 6
    • 42749084674 scopus 로고    scopus 로고
    • Prediction of fiber coating thickness via liquid-phase process
    • Yanga A, Tao X M and Cheng X Y 2008 Prediction of fiber coating thickness via liquid-phase process J. Matprotec 202 365-73
    • (2008) J. Matprotec , vol.202 , pp. 365-373
    • Yanga, A.1    Tao, X.M.2    Cheng, X.Y.3
  • 8
    • 80052033159 scopus 로고    scopus 로고
    • Characterization of SWNT-reinforced conductive polymer and patterning technique for applications of electronic textile
    • Khumpuang S, Miyake K and Itoh T 2011 Characterization of SWNT-reinforced conductive polymer and patterning technique for applications of electronic textile Sensors Actuators A 169 378-82
    • (2011) Sensors Actuators A , vol.169 , Issue.2 , pp. 378-382
    • Khumpuang, S.1    Miyake, K.2    Itoh, T.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.