MTTF evaluations of encapsulation materials for LED package in accelerated thermal tests

16th Opto-Electronics and Communications Conference, OECC 2011

Volumn , Issue , 2011, Pages 511-512

  Liou, Jyun Sian ^a   Tsai, Chun Chin ^a   Cheng, Wei Chih ^a   Huang, Shun Yuan ^a   Cheng, Gi Hung ^a   Chang, Jin Kai ^a   Wang, Jimmy ^a   Cheng, Wood Hi ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

GLASS MATERIALS; SCALE PARAMETER; SHAPE PARAMETERS; THERMAL TESTS; WEIBULL;

GLASS;

EID: 80053326889     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. H. Luo, J. K. Kim el at, Analysis of high-power packages for phosphor-based white-light-emitting diodes, Applied Physics Letters, 2005, vol. 86, no.24, pp. 24350-1-24350-3.
2. T. Yanagisawa and T. Kojima, Long-term accelerated current operation of white light-emitting diodes, Journal Luminescence, 2005, vol. 114, pp. 39-42. (Pubitemid 40845053)
3. J. Wang, C. H. Chung, C. C. Tsai el at, High Thermal Stability of High-Power Phosphor Based White-Light -Emitting Diodes Employing Ce:YAG-Doped Glass, ECTC, Las Vegas, 2010, NV, USA. June1-4.