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Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering
Volumn 27, Issue 8, 2011, Pages 61-64
Curing reaction of multifunctional epoxy resins
Author keywords

Cure reaction; DSC; Epoxy resin; Kinetic model
Indexed keywords

CURE REACTIONS; CURING AGENTS; CURING PARAMETERS; CURING PROCESS; CURING REACTIONS; CURING REACTIVITY; DEGREE OF CURE; DSC; DSC CURVES; EPOXY RESIN SYSTEM; KINETIC MODEL; KINETIC MODELS; KISSINGER; METHYL NADIC ANHYDRIDES; N-TH ORDER REACTION; NON-ISOTHERMAL DSC; RATE OF REACTION; TEMPERATURE PARAMETERS;
EID: 80053069513     PISSN: 10007555     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (4)
References (9)
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  • 4
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  • 7
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    • Li J G, Wang C Z, Yu Y H, et al. Application in pultrusion of the vinylester resin curing kinetics[J]. Polym. Mater. Sci. and Eng., 2004, 20(3): 183-186.
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  • 9
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.