A study of cure kinetics by the use of dynamic differential scanning calorimetry

Composites Science and Technology

Volumn 62, Issue 1, 2002, Pages 29-40

  Um, Moon Kwang ^a   Daniel, Isaac M ^b   Hwang, Byung Sun ^a  

^a Korea Institute of Machine and Materials   (South Korea)

^b Northwestern University   (United States)

Author keywords

Cure kinetics; Dynamic scanning calorimetry; Liquid molding; Phenomenological model

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; FILLING; KINETIC THEORY; TEMPERATURE DISTRIBUTION; THERMOSETS; VISCOSITY;

CURE KINETICS; MOLD FILLING;

COMPOSITE MATERIALS;

CALORIMETRY; CURING; KINETICS; MOLDING;

EID: 0036167780     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0266-3538(01)00188-9     Document Type: Article

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