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Volumn , Issue , 2011, Pages 89-94

Dimetrodon: Processor-level preventive thermal management via idle cycle injection

Author keywords

Average case design; Idle injection; Thermal management

Indexed keywords

APPLICATION PERFORMANCE; AVERAGE-CASE; AVERAGE-CASE DESIGN; COMMODITY OPERATING SYSTEMS; DYNAMIC THERMAL MANAGEMENT; IDLE CYCLES; IDLE INJECTION; ITS EFFICIENCIES; TEMPERATURE REDUCTION; THERMAL CONTROL; THERMAL MARGINS;

EID: 80052659158     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (29)

References (30)
  • 1
    • 84870455720 scopus 로고    scopus 로고
    • SPEC CPU2006. http://www.spec.org /cpu2006/.
    • SPEC CPU2006
  • 2
    • 70450268335 scopus 로고    scopus 로고
    • SPECWeb2005. http://www.spec.org/web2005/.
    • SPECWeb2005
  • 3
    • 84870566233 scopus 로고    scopus 로고
    • SPECWeb2009. http://www.spec.org/web2009/.
    • SPECWeb2009
  • 6
    • 40449106252 scopus 로고    scopus 로고
    • In the data center, power and cooling costs more than the it equipment it supports
    • February
    • BELADY, C. In the data center, power and cooling costs more than the it equipment it supports. Eleclronics Cooling 23, 1 (February 2007).
    • (2007) Eleclronics Cooling , vol.23 , pp. 1
    • Belady, C.1
  • 7
    • 0006255232 scopus 로고
    • Thermal regulation in sail lizards
    • BRAMWELL, C. D., AND FELLGETT, P. B. Thermal regulation in sail lizards. Nature 242 (1973), 203-205.
    • (1973) Nature , vol.242 , pp. 203-205
    • Bramwell, C.D.1    Fellgett, P.B.2
  • 8
    • 0034836755 scopus 로고    scopus 로고
    • Dynamic thermal management for high-performance microprocessors
    • BROOKS, D., AND MARTONOSI, M. Dynamic thermal management for high-performance microprocessors. In HPCA '01.
    • HPCA '01
    • Brooks, D.1    Martonosi, M.2
  • 11
    • 12844249966 scopus 로고    scopus 로고
    • Heat-and-run: Leveraging SMT and CMP to manage power density through the operating system
    • GOMAA, M., POWELL, M. D., AND VIJAYKUMAR, T. N. Heat-and-run: leveraging SMT and CMP to manage power density through the operating system. In ASPLOS '04.
    • ASPLOS '04
    • Gomaa, M.1    Powell, M.D.2    Vijaykumar, T.N.3
  • 13
    • 36949001469 scopus 로고    scopus 로고
    • An analysis of efficient multi-core global power management policies: Maximizing performance for a given power budget
    • ISCI, C., BUYUKTOSUNOGLU, A., CHER, C.-Y., BOSE, P., AND MARTONOSI, M. An analysis of efficient multi-core global power management policies: Maximizing performance for a given power budget. In MICRO '06.
    • MICRO '06
    • Isci, C.1    Buyuktosunoglu, A.2    Cher, C.-Y.3    Bose, P.4    Martonosi, M.5
  • 14
    • 80052664632 scopus 로고    scopus 로고
    • System level analysis of fast, per-core DVFS using on-chip switching regulators
    • KIM, W., GUPTA, M., WEI, G. Y., AND BROOKS, D. System level analysis of fast, per-core DVFS using on-chip switching regulators. In ISCA '08.
    • ISCA '08
    • Kim, W.1    Gupta, M.2    Wei, G.Y.3    Brooks, D.4
  • 16
    • 33845897992 scopus 로고    scopus 로고
    • Making scheduling "cool": Temperature-aware workload placement in data centers
    • MOORE, J., CHASE, J., RANGANATHAN, P., AND SHARMA, R. Making scheduling "cool": temperature-aware workload placement in data centers. In USENIX ATC '05.
    • USENIX ATC '05
    • Moore, J.1    Chase, J.2    Ranganathan, P.3    Sharma, R.4
  • 19
    • 0002507796 scopus 로고    scopus 로고
    • Real-time dynamic voltage scaling for low-power embedded operating systems
    • PILLAI, P., AND SHIN, K. G. Real-time dynamic voltage scaling for low-power embedded operating systems. In SOSP '01.
    • SOSP '01
    • Pillai, P.1    Shin, K.G.2
  • 22
  • 24
    • 80052680762 scopus 로고    scopus 로고
    • Temperature measurement in the Intel Core Duo processor
    • ROTEM, E., COHEN, A., AND CAIN, H. Temperature measurement in the Intel Core Duo processor. In THERMINIC '06.
    • THERMINIC '06
    • Rotem, E.1    Cohen, A.2    Cain, H.3
  • 25
    • 26844546666 scopus 로고    scopus 로고
    • Thermal integrity: A must for low-power IC digital design
    • September
    • SANTARINI, M. Thermal integrity: A must for low-power IC digital design. EON (September 2005), 37-42.
    • (2005) EON , pp. 37-42
    • Santarini, M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.