SCOPUS 정보 검색 플랫폼

Soft Matter

Volumn 7, Issue 18, 2011, Pages 8657-8662

Mechanics of reversible adhesion

(7) Wu, Jian a Kim, Seok b Chen, Weiqiu c Carlson, Andrew b Hwang, Keh Chih a Huang, Yonggang d Rogers, John A b,e

a TSINGHUA UNIVERSITY (China)

b University of Illinois at Urbana Champaign (United States)

c ZHEJIANG UNIVERSITY (China)

d Northwestern University (United States)

e UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE MATERIAL; ANALYTICAL EXPRESSIONS; GROWTH SUBSTRATES; MECHANICS MODELS; MICROTIPS; ORDERS OF MAGNITUDE; STAMP DESIGN; SURFACE CONTACT; TRANSFER PRINTING;

MECHANICS; PRINTING; SURFACES;

ADHESION;

EID: 80052531607 PISSN: 1744683X EISSN: 17446848 Source Type: Journal
DOI: 10.1039/c1sm05915g Document Type: Article

Times cited : (53)

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