Current transport in thick film Ag metallization: Direct contacts at Silicon pyramid tips?

Energy Procedia

Volumn 8, Issue , 2011, Pages 540-545

  Cabrera, E ^a   Olibet, S ^a   Glatz Reichenbach, J ^a   Kopecek, R ^a   Reinke, Daniel ^b   Schubert, Gunnar ^b  

^a International Solar Energy Research Center   (Germany)

^b Sunways AG   (Germany)

Author keywords

Current transport; Front contact formation; Screen printing; Silver paste

Indexed keywords

CRYSTALLINE MATERIALS; CRYSTALLITES; GLASS; METALLIZING; SCREEN PRINTING; SILICON; SILICON SOLAR CELLS; SOLAR CELLS; THICK FILMS;

CONTACT FORMATION; CRYSTALLINE SILICON SOLAR CELLS; CURRENT TRANSPORT; EFFICIENCY IMPROVEMENT; SELECTIVE EMITTERS; SILVER METALLIZATION; SILVER PASTES; SILVER THICK FILMS;

SILVER;

EID: 80052090387     PISSN: 18766102     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1016/j.egypro.2011.06.179     Document Type: Conference Paper

References (10)

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9. C. Khadilkar, S. Sridharan, Dave Gnizak, T. Pham, S. Kim, A. Shaikh, Effect of glass chemistry and silicon orientation on the front contact microstructure formation in a silicon solar cell, PVSEC-20, Barcelona, Spain (2005).
10. E. Cabrera, S. Olibet, J. Glatz-Reichenbach, R. Kopecek, D. Reinke, G. Schubert, Experimental evidence of direct contact formation for the current transport in silver thick film metalized silicon emitters, to be published.