Effect of coating on the microstructure and thermal conductivities of diamond-Cu composites prepared by powder metallurgy

Composites Science and Technology

Volumn 71, Issue 13, 2011, Pages 1550-1555

  Ren, Shubin ^a   Shen, Xiaoyu ^a   Guo, Caiyu ^a   Liu, Nan ^a   Zang, Jianbing ^a   He, Xinbo ^a   Qu, Xuanhui ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

A. Coating; A. Metal matrix composites; B. Interface; B. Thermal properties; E. Sintering

Indexed keywords

A. COATING; B. INTERFACE; CHEMICAL INCOMPATIBILITY; DIAMOND PARTICLES; E. SINTERING; EXPERIMENTAL VALUES; HIGH THERMAL; INTERFACE THERMAL RESISTANCE; INTERFACIAL BINDING; INTERFACIAL THERMAL RESISTANCE; LOW THERMAL CONDUCTIVITY; MATRIX; METAL MATRIX COMPOSITES; NEGATIVE IMPACTS; OPTIMUM THICKNESS; OUTER LAYER; THEORETICAL MODELS; TI COATING; WEAK INTERFACE;

CARBIDES; CARBON FIBER REINFORCED PLASTICS; CHROMATE COATINGS; CHROMIUM; POWDER METALLURGY; SINTERING; THERMAL CONDUCTIVITY OF SOLIDS; THERMODYNAMIC PROPERTIES; TITANIUM; VACUUM;

DIAMONDS;

EID: 80051947503     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2011.06.012     Document Type: Article

References (13)

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