|
Volumn 44, Issue 16, 2011, Pages 6318-6325
|
Thermally activated, single component epoxy systems
|
Author keywords
[No Author keywords available]
|
Indexed keywords
CURING TEMPERATURE;
EPOXY SYSTEMS;
SHELF LIFE;
SINGLE COMPONENTS;
SINGLE MOLECULE;
SINGLE-MOLECULE PRECURSORS;
THERMALLY ACTIVATED;
TWO-COMPONENT;
HARDENING;
MOLECULES;
RESINS;
EPOXY RESINS;
|
EID: 80051762823
PISSN: 00249297
EISSN: None
Source Type: Journal
DOI: 10.1021/ma200673v Document Type: Article |
Times cited : (20)
|
References (27)
|