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Volumn 24, Issue 3, 2011, Pages 255-258
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Rational approach for improving optical and mechanical properties of transparent polyimide for FPC Substrate
a a a a a a |
Author keywords
Coefficient of thermal expansion; Flexible printed circuit; Polyimide; Transparency
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Indexed keywords
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EID: 80051637188
PISSN: 09149244
EISSN: 13496336
Source Type: Journal
DOI: 10.2494/photopolymer.24.255 Document Type: Article |
Times cited : (10)
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References (7)
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