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Volumn 24, Issue 3, 2011, Pages 255-258

Rational approach for improving optical and mechanical properties of transparent polyimide for FPC Substrate

Author keywords

Coefficient of thermal expansion; Flexible printed circuit; Polyimide; Transparency

Indexed keywords


EID: 80051637188     PISSN: 09149244     EISSN: 13496336     Source Type: Journal    
DOI: 10.2494/photopolymer.24.255     Document Type: Article
Times cited : (10)

References (7)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.