Power noise suppression technique using active decoupling capacitor for TSV 3D integration

Proceedings - IEEE International SOC Conference, SOCC 2010

Volumn , Issue , 2010, Pages 209-212

  Lin, Tien Hung ^a   Huang, Po Tsang ^a   Hwang, Wei ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; 65NM CMOS TECHNOLOGY; DECOUPLING CAPACITOR; LOW POWER; NOISE DETECTION; NOISE SUPPRESSION; POWER NOISE; POWER-SUPPLY NOISE; SIMULTANEOUS SWITCHING NOISE; SUPPLY CURRENTS; SUPPLY NOISE; SUPPLY VOLTAGES; THREE DIMENSIONAL (3D) INTEGRATION; THROUGH-SILICON-VIA;

CAPACITORS; CMOS INTEGRATED CIRCUITS; INTEGRATION; NATURAL FREQUENCIES;

THREE DIMENSIONAL;

EID: 79960726095     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SOCC.2010.5784737     Document Type: Conference Paper

References (7)

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