Ultra-low temperature deposition of copper seed layers by PEALD

ECS Transactions

Volumn 33, Issue 12, 2010, Pages 125-135

  Mao, J ^a   Eisenbraun, E ^a   Omarjee, V ^b   Korolev, A ^b   Lansalot, C ^b   Dussarrat, C ^b  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b AIR LIQUIDE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; GROWTH RATE; INTEGRATION; TEMPERATURE;

COPPER DEPOSITION; COPPER SEED; FILM COMPOSITION; FLUORINE-FREE; INTERCONNECT SYSTEMS; PROCESSING CONDITION; STEP COVERAGE; ULTRA LOW TEMPERATURES;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 79960362445     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3501039     Document Type: Conference Paper

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6. M. Zhang et al. Interconnect technology conference, IEEE, p170-172 (1999)
7. J.Mao et al., 2009 MRS Fall meeting, Symposium B (2009).