A 32 x 32 element row-column addressed capacitive micromachined ultrasonic transducer

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

Volumn 58, Issue 6, 2011, Pages 1266-1271

  Logan, Andrew S ^a   Wong, Lawrence L P ^a   Chen, Albert I H ^a   Yeow, John T W ^a  

^a UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

A-CENTER; ADDRESSING SCHEME; BEAM FORMERS; BEAM PROFILES; CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER; EFFECTIVE APERTURE; FABRICATION PROCESS; INSULATION LAYERS; NEAR-FIELD; PIN HEADS; RELATIVE BANDWIDTH; ROW-COLUMN; THREE DIMENSIONAL IMAGES; WAFER BONDING PROCESS;

IMAGE RESOLUTION; SILICON NITRIDE; SILICON WAFERS; THREE DIMENSIONAL; ULTRASONIC EQUIPMENT; ULTRASONIC MEASUREMENT; ULTRASONIC TRANSDUCERS; ULTRASONIC WAVES; ULTRASONICS; WAFER BONDING;

TRANSDUCERS;

ECHOGRAPHY; ELECTRIC CAPACITANCE; IMAGE PROCESSING; INSTRUMENTATION; LETTER; MICROTECHNOLOGY; SCANNING ELECTRON MICROSCOPY; SIGNAL PROCESSING; TRANSDUCER;

ELECTRIC CAPACITANCE; IMAGE PROCESSING, COMPUTER-ASSISTED; MICROSCOPY, ELECTRON, SCANNING; MICROTECHNOLOGY; SIGNAL PROCESSING, COMPUTER-ASSISTED; TRANSDUCERS; ULTRASONOGRAPHY;

EID: 79959543127     PISSN: 08853010     EISSN: None     Source Type: Journal    
DOI: 10.1109/TUFFC.2011.1937     Document Type: Article

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