Effect of thermal curing on the properties of thin films based on benzophenonetetracarboxylic dianhydride and 4,4′-diamino-3,3′- dimethyldiphenylmethane

Journal of Thermal Analysis and Calorimetry

Volumn 104, Issue 3, 2011, Pages 1135-1143

  Sava, Ion ^a   Chişcǎ, Ştefan ^a   Brumǎ, Maria ^a   Lisa, Gabriela ^b  

^a PETRU PONI INSTITUTE OF MACROMOLECULAR CHEMISTRY   (Romania)

^b GHEORGHE ASACHI TECHNICAL UNIVERSITY OF IASI   (Romania)

Author keywords

Dynamic mechanical analysis; Polyamidic acids; Thermal treatment; Thin films

Indexed keywords

ACID SOLUTIONS; BENZOPHENONETETRACARBOXYLIC DIANHYDRIDE; CHEMICAL CONVERSIONS; CURING TEMPERATURE; DIELECTRIC MEASUREMENTS; DIMETHYLDIPHENYLMETHANE; DIPHENYLMETHANE; IMIDIZATION; MECHANICAL AND DIELECTRIC PROPERTIES; POLYAMIDIC ACIDS; POLYIMIDE FILM; STRUCTURAL REORGANIZATION; THERMAL CURING;

CONTACT ANGLE; CURING; DIELECTRIC PROPERTIES; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; DYNAMICS; HEAT TREATMENT; MECHANICAL PROPERTIES; POLYIMIDES; POLYMERIC FILMS; THIN FILMS;

POLYMER FILMS;

EID: 79959453166     PISSN: 13886150     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10973-011-1345-8     Document Type: Article

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