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Volumn 99, Issue 1, 2011, Pages 135-140
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Damage of chromia thermal oxide films formed on NiCr-30 alloys. Stress relaxation mechanisms either by creep or mechanical buckling;Endommagement de films d'oxydes thermiques de chromine sur NiCr30. Relaxation de contrainte par fluage ou par cloquage mécanique
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Author keywords
Damage; High temperature oxidation; Modelling; NiCr30; Raman spectroscopy; Stress
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Indexed keywords
CHROMIA;
COOLING RATES;
DAMAGE;
DAMAGE MECHANISM;
DAMAGE PROCESS;
DELAMINATED SURFACES;
GROWTH STRESS;
LOCAL DAMAGE;
MICROSTRUCTURAL PARAMETERS;
MODELLING;
NICR30;
OPTIMISATIONS;
OXIDATION TEMPERATURE;
OXIDE GRAINS;
OXIDIZED SURFACES;
RELAXATION MECHANISM;
RELEASE MECHANISM;
STRESS COMPONENT;
STRESS MAGNITUDE;
TEMPERATURE RANGE;
THERMAL OXIDE FILMS;
THERMO-MECHANICAL;
COOLING;
CREEP;
FILM GROWTH;
GRAIN GROWTH;
MECHANISMS;
MICROSTRUCTURAL EVOLUTION;
OXIDATION;
OXIDE FILMS;
RAMAN SCATTERING;
RAMAN SPECTROSCOPY;
RESIDUAL STRESSES;
SPALLING;
STRESS RELAXATION;
BUCKLING;
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EID: 79959331896
PISSN: 00326895
EISSN: 17783771
Source Type: Journal
DOI: 10.1051/mattech/2011003 Document Type: Article |
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Times cited : (1)
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References (6)
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