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Volumn , Issue , 2011, Pages
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Multicenter comparison of alpha particle measurements and methods typical of semiconductor processing
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Author keywords
alpha particles; device packaging; semiconductor device reliability; soft errors
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Indexed keywords
ALPHA EMISSIONS;
DEVICE PACKAGING;
LOW ALPHA;
MEASUREMENT METHODS;
PACKAGING APPLICATIONS;
PARTICLE MEASUREMENT;
REPLICATE MEASUREMENTS;
ROUND ROBIN;
SEMICONDUCTOR DEVICE RELIABILITY;
SEMICONDUCTOR INDUSTRY;
SEMICONDUCTOR PROCESSING;
SEMICONDUCTOR PRODUCTION;
SOFT ERROR;
STANDARD DEVIATION;
STRONG CORRELATION;
SYSTEMATIC VARIATION;
ALPHA PARTICLES;
CHIP SCALE PACKAGES;
ELECTROMAGNETIC WAVE EMISSION;
PACKAGING MATERIALS;
RELIABILITY;
SEMICONDUCTOR DEVICE MANUFACTURE;
UNCERTAINTY ANALYSIS;
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EID: 79959325979
PISSN: 15417026
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IRPS.2011.5784521 Document Type: Conference Paper |
Times cited : (9)
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References (8)
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