Enhanced boiling heat transfer by using micro-pin-finned surface in three different test systems

Heat Transfer Engineering

Volumn 32, Issue 11-12, 2011, Pages 1062-1068

  Xue, Yanfang ^a   Yuan, Minzhe ^a   Ma, Aixiang ^a   Wei, Jinjia ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; DRY ETCHING; ELECTRONIC COOLING; FINS (HEAT EXCHANGE); HEAT FLUX; NATURAL CONVECTION; SURFACE TESTING; TEST FACILITIES; THERMAL MANAGEMENT (ELECTRONICS);

BOILING HEAT TRANSFER; COOLING ELECTRONIC COMPONENTS; CRITICAL HEAT FLUX(CHF); DRY ETCHING TECHNIQUES; FLUID VELOCITIES; HEAT TRANSFER ENHANCEMENT; NATURAL CIRCULATION; THREE TEST SYSTEMS;

HEAT TRANSFER PERFORMANCE;

EID: 79958712982     PISSN: 01457632     EISSN: 15210537     Source Type: Journal    
DOI: 10.1080/01457632.2011.556501     Document Type: Conference Paper

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