Mechanical properties of a microcapsule-containing epoxy for self-healing applications

Advanced Materials Research

Volumn 239-242, Issue , 2011, Pages 1794-1798

  Liu, Xing ^a   Lee, Jong Keun ^b  

^a TIANJIN POLYTECHNIC UNIVERSITY   (China)

^b Kumoh National Institute of Technology   (South Korea)

Author keywords

Epoxy; Mechanical property; Microcapsule; Self healing

Indexed keywords

DYNAMIC MECHANICAL PROPERTY; EPOXY; INTERFACIAL INTERACTION; MICROCAPSULES; SELF-HEALING;

ENCAPSULATION;

MECHANICAL PROPERTIES;

EID: 79957876225     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.239-242.1794     Document Type: Conference Paper

References (13)

1. E.N. Brown, S.R. White and N.R. Sottos: J Mater Sci Vol. 39 (2004), p.1703.
2. D. Jung: Performance and properties of embedded microspheres for self-repairing applications. Master thesis, University of Illinois at Urbana-Champaign, Urbana, USA, 1997.
3. H.R. Azimi, R.A. Pearson and R.W. Hertzberg: Polym Eng Sci Vol. 36 (1996). P.2352.
4. R. Bagheri and R.A. Pearson: Polymer Vol. 37 (1996), p.4529.
5. M.A. EL-Hadek and H.V. Tippur: J Mater Sci Vol. 37 (2002), p.1649.
6. H.S. Kim and M.A. Khamis: Compos Part A-Appl Sci Manuf Vol. 32 (2001), p.1311.
7. H. Toda, H. Kagajo, K. Hosoi, T. Kobayashi, Y. Ito and T. Higashihara: J Soc Mater Sci, Japan Vol. 50 (2001), p.474.
8. A.M. Zihlif and G. Ragosta: Polym Polym Compos Vol. 9 (2001), p.345.
9. S.R. White, N.R. Sottos, P.H. Geubelle, J.S. Moore JS, M.R. Kessler, and S.R. Sriram: Nature Vol. 409 (2001), p.794.
10. W. Schnabel and J. Kiwi, In: Degradation and stabilization of polymers, edited by H.H.G. Jellinek. Amsterdam: Elsevier Science (1978).
11. E.N. Brown, N.R. Sottos and S.R. White: Exp Mech Vol 42 (2002), p.372.
12. M.R. Kessler, N.R. Sottos and S.R. White: Compos Part A-Appl Sci Manuf Vol. 34 (2003), p. 743.
13. X. Liu, X. Sheng, J.K. Lee and M.R. Kessler: Macromol Mater Eng Vol. 294 (2009), p.389.