The impact of various nanofluid types on triangular microchannels heat sink cooling performance

International Communications in Heat and Mass Transfer

Volumn 38, Issue 6, 2011, Pages 767-773

  Mohammed, H A ^a   Gunnasegaran, P ^a   Shuaib, N H ^a  

^a Universiti Tenaga Nasional   (Malaysia)

Author keywords

Heat transfer enhancement; Nanofluids; Numerical simulation; Triangular microchannel heat sink

Indexed keywords

COOLING PERFORMANCE; FLOW AND HEAT TRANSFER; GOVERNING EQUATIONS; HEAT TRANSFER AND FLUID FLOW; HEAT TRANSFER ENHANCEMENT; HIGHEST TEMPERATURE; LOW PRESSURE DROP; MICRO CHANNEL HEAT SINKS; NANO-FLUID; NANOFLUIDS; NUMERICAL SIMULATION; PURE WATER; TIO; TRIANGULAR MICROCHANNELS; WALL SHEAR STRESS;

DIAMONDS; FINITE VOLUME METHOD; HEAT SINKS; HEAT TRANSFER COEFFICIENTS; LAMINAR FLOW; MICROCHANNELS; NUMERICAL METHODS; PRESSURE DROP; SHEAR STRESS; SILICON COMPOUNDS; SILVER; TITANIUM DIOXIDE;

NANOFLUIDICS;

EID: 79957874230     PISSN: 07351933     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.icheatmasstransfer.2011.03.024     Document Type: Article

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