The effect of electro-discharge machined sonotrode topology on interlaminar bonding in Ultrasonic Consolidation

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7978, Issue , 2011, Pages

  Edmonds, H C ^a   Harris, R A ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Electro discharge machining; Surface roughness; Ultrasonic additive manufacturing; Ultrasonic Consolidation; White light interferometry

Indexed keywords

ADDITIVE MANUFACTURING PROCESS; BOND STRENGTH; BRITTLE FAILURES; DUCTILE FAILURES; ELECTRO DISCHARGE MACHINING; ELECTRODISCHARGES; INTERLAMINAR; LAYER-BY-LAYERS; LINEAR WELD DENSITY; PEEL TESTING; PROCESSING CONDITION; SAMPLE SURFACE; SONOTRODES; SURFACE TEXTURES; THREE-DIMENSIONAL OBJECT; ULTRASONIC CONSOLIDATION; WELD STRENGTH; WHITE LIGHT INTERFEROMETRY;

BOND STRENGTH (MATERIALS); BONDING; FAILURE MODES; INTERFEROMETRY; MACHINING; MANUFACTURE; MECHANICS; METAL FOIL; RELIABILITY ANALYSIS; SURFACE ROUGHNESS; SURFACES; TEXTURES; WELDING; WELDS;

ULTRASONICS;

EID: 79957851632     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.880464     Document Type: Conference Paper

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