Aluminum-matrix composites with embedded ni-ti wires by ultrasonic consolidation

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7290, Issue , 2009, Pages

  Hahnlen, Ryan ^a   Dapino, Marcelo J ^a   Short, Matt ^b   Graff, Karl ^b  

^a OHIO STATE UNIVERSITY   (United States)

^b EDISON WELDING INSTITUTE   (United States)

Author keywords

Active composites; Metal matrix composite; Ni Ti; Shape memory alloy; Ultrasonic additive manufacturing

Indexed keywords

ACTIVE COMPOSITES; ADAPTIVE STRUCTURE; ADDITIVE MANUFACTURING; ALUMINUM MATRIX; AREA RATIOS; BRINSON CONSTITUTIVE MODEL; COMPOSITE MATRICES; CROSS SECTIONAL AREA RATIO; ELECTRONIC COMPONENT; FABRICATION PROCESS; MATRIX; MATRIX COMPOSITE; MECHANICAL CHARACTERIZATIONS; METAL MATRIX COMPOSITE; NI-TI; NI-TI WIRE; PARENT MATERIALS; PROCESS TEMPERATURE; PROTOTYPING PROCESS; RESISTIVITY CHANGES; SHAPE MEMORY; SHAPE MEMORY ALLOY; SMART MATERIALS; SMART VEHICLES; STRAIN SENSING; STRAIN SENSORS; TEMPERATURE CHANGES; ULTRASONIC CONSOLIDATION; ULTRASONIC METAL WELDING;

ALLOYS; ALUMINA; ALUMINUM; AUTOMOBILE PARTS AND EQUIPMENT; CONCRETE BRIDGES; CONCURRENT ENGINEERING; CONSTITUTIVE MODELS; GRAIN REFINEMENT; IMAGE SENSORS; JOB ANALYSIS; MARTENSITIC TRANSFORMATIONS; MECHANICAL PROPERTIES; METALS; NICKEL; RAPID PROTOTYPING; SHAPE MEMORY EFFECT; STIFFNESS; STIFFNESS MATRIX; STRAIN; TITANIUM ALLOYS; ULTRASONIC IMAGING; ULTRASONICS; WIRE;

METALLIC MATRIX COMPOSITES;

EID: 66749184904     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.817036     Document Type: Conference Paper

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