New prototype assembly methods for biosensor integrated circuits

Medical Engineering and Physics

Volumn 33, Issue 8, 2011, Pages 973-979

  Graham, Anthony H D ^a   Bowen, Chris R ^b   Surguy, Susan M ^c   Robbins, Jon ^c   Taylor, John ^a  

^a University of Bath   (United Kingdom)

^b University of Bath   (United Kingdom)

^c KING'S COLLEGE LONDON   (United Kingdom)

Author keywords

Assembly; Biosensor; Integrated circuit; Packaging; Partial encapsulation; Prototype

Indexed keywords

BOND PAD; CELL LINES; CULTURE CHAMBERS; ELECTRICAL INSULATION; PARTIAL ENCAPSULATION; PROTOTYPE; ROOM TEMPERATURE; SENSOR AREA; SILICONE ELASTOMERS;

BIOCOMPATIBILITY; CELL CULTURE; ETHYLENE; ETHYLENE GLYCOL; INTEGRATED CIRCUITS; INTEGRATION; SENSORS; SILICONES;

BIOSENSORS;

MACROGOL; SILASTIC;

ARTICLE; BIOCOMPATIBILITY; BIOMEDICAL TECHNOLOGY ASSESSMENT; BIOSENSOR; CELL DENSITY; CONTROLLED STUDY; ENCAPSULATION; IMPEDANCE; INTEGRATED CIRCUIT; MOULD BASED ASSEMBLY; NERVE CELL; NERVE CELL CULTURE; PACKAGING; PARTIAL ENCAPSULATION; PRIORITY JOURNAL; PROCESS TECHNOLOGY;

ANIMALS; BIOSENSING TECHNIQUES; CELL LINE; ELECTRODES; LAB-ON-A-CHIP DEVICES; MATERIALS TESTING; POLYETHYLENE GLYCOLS;

EID: 79957743615     PISSN: 13504533     EISSN: 18734030     Source Type: Journal    
DOI: 10.1016/j.medengphy.2011.03.006     Document Type: Article

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