Thermal and mechanical properties of polyimide/nano-silica hybrid films

Thin Solid Films

Volumn 519, Issue 15, 2011, Pages 5238-5242

  Tsai, Mei Hui ^a   Huang, Yi Chia ^a   Tseng, I Hsiang ^a   Yu, Hsin Pei ^a   Lin, Yin Kai ^b   Huang, Shih Liang ^a  

^a NATIONAL CHIN YI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Coefficient of thermal expansion; Hybrid films; Polyimide; Silica; Transmittance

Indexed keywords

AVERAGE SIZE; COEFFICIENT OF THERMAL EXPANSION; GOOD COMPATIBILITY; HYBRID FILM; HYBRID FILMS; HYDROGEN BONDINGS; LOW MOLECULAR WEIGHT; MATRIX; MOLAR RATIO; NOVEL ROUTE; PHTHALIC ANHYDRIDES; POLYAMIC ACIDS; SEMI-INTERPENETRATING POLYMER NETWORK (SEMI-IPN); SILICA NANOPARTICLES; STORAGE MODULI; THERMAL AND MECHANICAL PROPERTIES; TRANSMITTANCE; WELL-DISPERSED;

COUPLING AGENTS; ELASTIC MODULI; HYDROGELS; HYDROGEN BONDS; NANOPARTICLES; O RINGS; POLYIMIDES; PROPANE; SILICA; SOLS;

THERMAL EXPANSION;

EID: 79957665583     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2011.01.167     Document Type: Conference Paper

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