Thermal transient characterization methodology for single-chip and stacked structures

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2005, Pages 313-321

  Steffens, Oliver ^b   Szabó, Péter ^a   Lenz, Michael ^b   Farkas, Gábor ^a  

^a MicReD Ltd   (Hungary)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC IMPEDANCE; ELECTRONICS PACKAGING; HEAT RESISTANCE; MOSFET DEVICES; SEMICONDUCTOR JUNCTIONS; THERMAL VARIABLES MEASUREMENT;

HEAT FLOW; SINGLE-CHIPS; STACKED STRUCTURE; THERMAL TRANSIENT CHARACTERIZATION;

MICROPROCESSOR CHIPS;

EID: 28144436334     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. th SEMITHERM, San José, pp. 120-125 (2001).
2. D. Schweitzer, H. Pape: Thermal Impedance of Packages in Dual Cold Plate Environments, Proc. 7th THERMINIC, Paris, pp. 245-249 (2001).
3. D. Schweitzer, H. Pape: Thermal Transient Modelling and Experimental Validation of Power Packages, Proceedings 8th THERMINIC, Madrid, pp. 17-22 (2002).
4. M. Rencz et al.: A procedure to correct the error in the structure function based thermal measuring methods, Proceedings 20th SEMITHERM, San José, pp. 92-98 (2004).
5. V. Székely, A. Páhi, M. Rencz: SUNRED, a new field solving approach. Proceedings of the Symposium on Design, Test and Microfabrication of MEMS/MOEMS, Paris, pp. 278-288 (1999). See also www.micred.com/sunred.html.
6. D. Schweitzer, H. Pape: Boundary Condition Independent Dynamic Thermal Compact Models of IC Packages, Proceedings. 9th THERMINIC, Aix-en-Provence (2003).
7. B. Siegal: An alternative approach to junction-to-case thermal resistance measurements, Electronics Cooling Magazine, vol. 7, no. 2, May 2001.
8. [www.electronics-cooling.com/html/2001_may_a4.html]
9. J.W. Sofia: Analysis of thermal transient data with synthesized dynamic models for semiconductor devices. IEEE Transactions. on Component Packaging & Manufacturing Vol. 18, no. 1, pp. 39-47 (1995).
10. E.N. Protonotarios, O. Wing: Theory of nonuniform RC lines, IEEE Trans. on Circuit Theory, vol. 14, no. 1, pp. 2-12 (1967).
11. www.micred.com/strfunc.html.
12. V. Székely, Tran Van Bien: Fine structure of heat flow path in semiconductor devices: a measurement and identification method, Solid-State Elec. vol. 31, pp. 1363-1368 (1988).
13. Poppe, V. Székely: Dynamic Temperature Measurements: Tools Providing a Look into Package and Mount Structures, Electronics Cooling Magazine, vol. 8, no. 2, May 2002 [www.electronics-cooling.com/html/2002 may a1.html].
14. M. Rencz, et al.: Determining partial thermal resistances with transient measurements and using the method to detect die attach discontinuities, Proc. 17th SEMITHERM, San José, pp. 15-20 (2002).
15. P. Szabó, O. Steffens, M. Lenz, G. Farkas: Transient junction-to-case thermal resistance measurements of high accuracy and high repeatability, Proc. 10th THERMINIC, Sofia-Antipolis, pp. 145-150 (2004).