Near-wall liquid layering, velocity slip, and solid-liquid interfacial thermal resistance for thin-film evaporation in microchannels

Nanoscale and Microscale Thermophysical Engineering

Volumn 15, Issue 2, 2011, Pages 105-122

  Zhao, Jun Jie ^a   Huang, Mei ^a   Min, Qi ^a   Christopher, David M ^a   Duan, Yuan Yuan ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

evaporating thin film; Kapitza resistance; liquid layering; liquid velocity slip; microchannel; solid liquid interface

Indexed keywords

COMBINED EFFECT; EVAPORATING THIN FILM; HYDROPHILIC AND HYDROPHOBIC; HYDROPHOBIC SURFACES; INTERFACIAL TEMPERATURE; INTERFACIAL THERMAL RESISTANCE; KAPITZA RESISTANCE; LIQUID FLOW; LIQUID VELOCITIES; LIQUID VELOCITY SLIP; NANO LAYERS; NEAR-WALL; PHYSICAL MODEL; SLIP LENGTH; SOLID-LIQUID; SOLID-LIQUID INTERFACES; TEMPERATURE DROPS; THIN LIQUID FILM; U-SHAPED; VELOCITY SLIPS; YOUNG LAPLACE EQUATION;

HEAT RESISTANCE; HEAT TRANSFER; HYDROPHOBICITY; LAPLACE EQUATION; LIQUID FILMS; MICROCHANNELS; PHASE TRANSITIONS; SURFACE CHEMISTRY; THERMAL EVAPORATION; THIN FILMS; VELOCITY;

PHASE INTERFACES;

EID: 79957590692     PISSN: 15567265     EISSN: None     Source Type: Journal    
DOI: 10.1080/15567265.2011.560927     Document Type: Article

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