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Volumn 132, Issue 1, 2010, Pages 1-9
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Molecular-scale mechanism of thermal resistance at the solid-liquid interfaces: Influence of interaction parameters between solid and liquid molecules
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Author keywords
Crystal plane; Solid liquid interface; Surface corrugation; Thermal energy transfer; Thermal resistance
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Indexed keywords
CRYSTAL PLANES;
DEGREE OF FREEDOM;
ELECTRO-MECHANICAL;
ELECTROMECHANICAL SYSTEMS;
HEAT CONDUCTION FLUX;
INTERACTION PARAMETERS;
INTERACTION STRENGTH;
INTERFACIAL THERMAL RESISTANCE;
LIQUID MOLECULES;
MEMS/NEMS;
MOLECULAR MOTIONS;
NANO SCALE;
NANOPARTICLE SUSPENSION;
NONEQUILIBRIUM MOLECULAR DYNAMICS SIMULATION;
NORMAL COMPONENT;
NUMBER DENSITY;
SOLID WALL;
SOLID-LIQUID;
SOLID-LIQUID INTERFACE;
SOLID-LIQUID INTERFACES;
SOLID-LIQUID SYSTEM;
THERMAL RESISTANCE;
TRANSLATIONAL MOTIONS;
TRANSPORT PHENOMENA;
ENERGY TRANSFER;
HEAT RESISTANCE;
LIQUID FILMS;
MOLECULAR DYNAMICS;
MOLECULES;
SUSPENSIONS (FLUIDS);
THERMAL ENERGY;
PHASE INTERFACES;
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EID: 77955294094
PISSN: 00221481
EISSN: 15288943
Source Type: Journal
DOI: 10.1115/1.3211856 Document Type: Article |
Times cited : (55)
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References (10)
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