Thermal sensing with lithographically patterned bimetallic thin-film thermocouples

IEEE Electron Device Letters

Volumn 32, Issue 6, 2011, Pages 818-820

  Varrenti, Andrew R ^a   Zhou, Chuanle ^a   Klock, A Grace ^a   Chyung, Seung H ^a   Long, Jieyi ^a   Memik, Seda Ogrenci ^a   Grayson, M ^a  

^a Northwestern University   (United States)

Author keywords

Seebeck coefficient; thermal coefficient measurements; thermal sensing; thermocouple; thin film devices

Indexed keywords

HEAT LOADS; ON-CHIP TEMPERATURE; PROOF OF CONCEPT; REPRODUCIBILITIES; SEEBECK; SEMICONDUCTOR SUBSTRATE; TEMPERATURE VARIATION; THERMAL COEFFICIENTS; THERMAL SENSING; THIN FILM THERMOCOUPLE;

SEEBECK COEFFICIENT; THERMOCOUPLES; THIN FILM DEVICES;

TEMPERATURE SENSORS;

EID: 79957582713     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2011.2136314     Document Type: Article

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