Worst-case temperature analysis for real-time systems

Proceedings -Design, Automation and Test in Europe, DATE

Volumn , Issue , 2011, Pages 631-636

  Rai, Devendra ^a   Yang, Hoeseok ^a   Bacivarov, Iuliana ^a   Chen, Jian Jia ^b   Thiele, Lothar ^a  

^a ETH ZURICH   (Switzerland)

^b KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

compositional analysis; real time systems; thermal analysis; worst case peak temperature

Indexed keywords

CHIP TEMPERATURE; COMPOSITIONAL ANALYSIS; DESIGN DECISIONS; EARLIEST DEADLINE FIRST; EMBEDDED REAL TIME SYSTEMS; EVENT MODEL; PEAK TEMPERATURES; POWER DENSITIES; REAL TIME CONSTRAINTS; REAL-TIME CALCULUS; REAL-TIME EMBEDDED SYSTEMS; SCHEDULABILITY; SEMICONDUCTOR TECHNOLOGY; TASK EXECUTIONS; TEMPERATURE ANALYSIS; THERMAL ANALYSIS; WORST-CASE PEAK TEMPERATURE;

DESIGN; EMBEDDED SYSTEMS; JITTER; RESPONSE TIME (COMPUTER SYSTEMS); SCHEDULING ALGORITHMS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR GROWTH; THERMOANALYSIS; UNCERTAINTY ANALYSIS;

REAL TIME SYSTEMS;

EID: 79957537197     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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