Interaction of silver nanopowder with copper substrate

Science of Sintering

Volumn 43, Issue 1, 2011, Pages 33-38

  Sopousek J ^a   Bursik J ^b   Zalesak J ^a   Bursikova V ^a   Broz P ^a  

^a MASARYK UNIVERSITY   (Czech Republic)

^b INSTITUTE OF PHYSICS OF MATERIALS   (Czech Republic)

Author keywords

Copper; DSC; Indentation; Silver; Sintering

Indexed keywords

EID: 79956347993     PISSN: 0350820X     EISSN: None     Source Type: Journal    
DOI: 10.2298/SOS1101033S     Document Type: Article

References (9)

1. W. A. Jesser, R. Z. Shneck, W. W. Gile, Physical Rewiew B, 69/14 (2004), 144121.
2. P. Pawlow, Z. Phys. Chem., 65 (1909), 545.
3. P. Buffat, J. P. Borel, Physical Review A, 13/6 (1976), 2287-2298.
4. C. R. M. Wronski, British J. Appl. Phys., 1967, 18 (1967), 1731-1737.
5. S. L. Lai, J. Y. Guo, V. Petrova, G. Ramanath, L. H. Allen, Physical Review Letters, 77/1 (1996), 99-102.
6. K. Dick, T. Dhanasekaran, Z. Y Zhang, D. Meisel, J. Am. Chem. Soc., 124/10 (2002),2312-2317.
7. J. P. Borel, Surf. Sci., 106/1 (1981), 1-9.
8. F. P. McCluskey, M. Dash, Z. Wang, D. Huff, in 17th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, Wuppertal, Germany, 2006, 46/9, 1910-1914.
9. nd Electronics System-Integration Technology Conference, SEP 01-04, 2008 Greenwich, England, 2008, 915-921.