Electrodeposition efficiency of Co and Cu in the fabrication of multilayer nanowires by polymeric track-etched templates

ACS Applied Materials and Interfaces

Volumn 3, Issue 3, 2011, Pages 759-764

  Pullini, D ^a   Busquets Mataix, D ^b  

^a CENTRO RICERCHE FIAT   (Italy)

^b UNIVERSITAT POLITÈCNICA DE VALÈNCIA   (Spain)

Author keywords

electroplating; magnetoresistance; multilayered nanowires; nanodevices

Indexed keywords

[CO/CU]; CURRENT EFFICIENCY; DEGREE OF POLARIZATION; DEPOSITION EFFICIENCIES; ELECTRODEPOSITION EFFICIENCY; MAGNETO RESISTIVE SENSORS; MULTILAYER NANOWIRES; MULTILAYERED NANOWIRES; MULTIPLE PARAMETERS; NANO-DEVICES; NANO-OBJECTS; NANO-POROUS; NANOPOROUS TEMPLATES; PORE DIAMETERS; PROCESS PARAMETERS; PULSED-ELECTRODEPOSITION; SINGLE BATH; SPACE CONFINEMENT;

ELECTRIC RESISTANCE; ELECTRODEPOSITION; MAGNETIC FIELD EFFECTS; MAGNETOELECTRONICS; MAGNETORESISTANCE; MULTILAYERS; NANOSTRUCTURED MATERIALS; POLYMERIC MEMBRANES; POLYMERS;

NANOWIRES;

COBALT; COPPER; NANOTUBE; POLYMER;

ARTICLE; CHEMISTRY; CONFORMATION; CRYSTALLIZATION; ELECTRIC CONDUCTIVITY; ELECTROPLATING INDUSTRY; MACROMOLECULE; MATERIALS TESTING; METHODOLOGY; NANOTECHNOLOGY; PARTICLE SIZE; SURFACE PROPERTY; ULTRASTRUCTURE;

COBALT; COPPER; CRYSTALLIZATION; ELECTRIC CONDUCTIVITY; ELECTROPLATING; MACROMOLECULAR SUBSTANCES; MATERIALS TESTING; MOLECULAR CONFORMATION; NANOTECHNOLOGY; NANOTUBES; PARTICLE SIZE; POLYMERS; SURFACE PROPERTIES;

EID: 79955960962     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am1011222     Document Type: Article

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