SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 40, Issue 6, 2011, Pages 1335-1344

Elastically stretchable insulation and bilevel metallization and its application in a stretchable RLC circuit

(3) Harris, J a Graudejus, O b Wagner, S c

a EXPONENT INC (United States)

b Arizona State University (United States)

c Princeton University (United States)

Author keywords

bilevel conductors; resonant circuit; stretchable conductors; Thin film

Indexed keywords

ALTERNATING CURRENT; BIAXIAL TENSILE STRAIN; BILEVEL; ELASTOMERIC MEMBRANES; ELECTRICAL PERFORMANCE; FABRICATION PROCESS; METALLIZATIONS; MULTILEVEL METALLIZATION; PRINTED WIRING BOARDS; RLC CIRCUIT; STRETCHABLE CONDUCTORS; STRETCHABLE ELECTRONICS; UNIAXIAL TENSILE STRAIN; VIA HOLE;

CIRCUIT RESONANCE; PRINTED CIRCUIT BOARDS;

METALLIZING;

EID: 79955906653 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-011-1613-1 Document Type: Article

Times cited : (15)

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